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                PCB制板

                PCB制板

                我们可提供各类型的PCB板生产,能满足客户样板】、中小批量◥的PCB快速制造服务。
                 

                制板能力
                 


                 

                制板工艺参数

                 
                 最高层数:40层;

                 

                 最小线宽/线距:3mil/3mil
                 
                 最大铜厚:10 OZ
                 
                 最小孔径:机械钻孔:4mil  激光钻孔: 3mil
                 
                 最大厚径比:18:1
                 
                 阻抗控制公差:±5%
                 
                 外型公差:±0.1mm
                 
                 材料:FR4、高Tg、无卤素、陶瓷填充、PI、BT、PPO、PPE、PTFE、高频/微波(Rogers、Taconic、
                 Arlon、F4B),金属基/芯(铝、铜、铁),Metal based/core

                 
                 表面处理:HASL、OSP、电金、沉金、沉银、沉锡
                 
                 特殊加工:刚挠结合、埋磁芯、埋光纤、埋电容/电阻、三阶叠孔HDI、盘中孔板、  内/外层镂¤空板、
                 高TG厚铜、混压、局部混压、多表面涂覆、金属基板/芯板、板边  金属化、埋孔、盲孔、台阶槽、
                 局部高密度、背钻、阻抗控制等